HJWAVE Signs MOU with Areum Electronics for Next-Generation Mobile Communication PCB Solution Development


 HJWAVE (CEO Yoo Tae-hwan), a leading company specializing in millimeter-wave RF components and materials, announced on the 19th that it will collaborate with Areum Electronics to jointly develop next-generation mobile communication PCB solutions.


On the same day, the two companies signed a memorandum of understanding (MOU) and agreed to cooperate in developing high-performance RF PCB solutions for next-generation mobile communication.


HJWAVE plans to leverage its expertise in millimeter-wave (mmWave, 30–300 GHz) RF design and high-frequency component development to create PCB solutions optimized for next-generation mobile networks. In particular, the company aims to enhance its competitiveness by incorporating high-frequency signal transmission stability and low-loss, high-efficiency circuit design technologies, which are essential for 5G and future 6G environments.


Yoo Tae-hwan, CEO of HJWAVE, stated, “By combining our RF technology with Areum Electronics’ PCB manufacturing capabilities, we can deliver innovative solutions for the next-generation communication market.” He added, “Through this partnership, we plan to establish ourselves as a comprehensive materials and components company that provides total solutions, leveraging our vertically integrated production system from SMT to module assembly.”


Areum Electronics, founded in 1984, has accumulated over 40 years of experience in PCB manufacturing and has been recognized for its technological expertise by supplying PCBs to major domestic automobile manufacturers. The company continues to grow based on its management philosophy of prioritizing quality.


Kim Han-jun, CEO of Areum Electronics, commented, “Areum Electronics is leading innovation in the PCB market as we prepare for the future of mobility industries, including artificial intelligence (AI), autonomous driving, and electric vehicles.” He added, “Through this MOU, Areum Electronics will take the lead in producing next-generation PCB modules for the mobile communication industry.”

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