HJWAVE Signs MOU with Areum Electronics for Next-Generation Mobile Communication PCB Solution Development
HJWAVE (CEO Yoo Tae-hwan), a leading company specializing in millimeter-wave RF components and materials, announced on the 19th that it will collaborate with Areum Electronics to jointly develop next-generation mobile communication PCB solutions. On the same day, the two companies signed a memorandum of understanding (MOU) and agreed to cooperate in developing high-performance RF PCB solutions for next-generation mobile communication. HJWAVE plans to leverage its expertise in millimeter-wave (mmWave, 30–300 GHz) RF design and high-frequency component development to create PCB solutions optimized for next-generation mobile networks. In particular, the company aims to enhance its competitiveness by incorporating high-frequency signal transmission stability and low-loss, high-efficiency circuit design technologies, which are essential for 5G and future 6G environments. Yoo Tae-hwan, CEO of HJWAVE, stated, “By combining our RF technology with Areum Electronics’ PCB manufacturing capab...